Optical Adhesives and Resins

Manufactured by NTT-AT, Japan who provide detailed solutions that meet customers' needs for various types of optical adhesive

Adhesives for Optical Waveguides
Adhesives for Fiber Array
High Precision Adhesives
Sealants for Optical Parts
Nano Imprint Lithography Resin
High Refractive Index Resins
Low Refractive Index Resins

Nano Imprint Resin

Model	Pre Baking	Irradition level (UV)*¹	Time (min)
Model	Current Condition			Infractive Index (after hardening) @589nm	Viscosity (mPa * s)	Tg (°C)	Optical Transmittance (Thickness: 2um) 450nm, 540nm, 630nm
#18247	-	100	1	1.710	138	125	95%, 96%, 97%
#18210	115°C 1min	100	5	1.725	15	100	94%, 95%, 95%

Process Image of UV nanoimprinting

Adhesive for Optical Paths

For optical Telecommunications

Model (Main Ingredient)	Irradition level (UV)*¹	Time (min)
Model (Main Ingredient)	Curing Condition (UV)		Refractive Index (after hardening) @589nm	Viscosity (mPa * s)	Tg (°C)	Optical Transmittance (%) @1.3um	Bond Strength (kgf/cm²)	Special Features
E3810 [Epoxy]	10	10	1.438	100	103	90	>61	Low refrative index, Low viscosity
GA700H (High Tg Type) [Epoxy]	30	10	1.458	280	145	91	>247	Refractive index adjusted to match silica glass (at 1.55um), High-Tg
GA700L (Low Tg Type) [Epoxy]	10	5	1.456	250	46	94	>154	Refractive index adjusted to match silica glass (at 1.55um), Low-Tg
AT6001 [Acrylate]	10	5	1.505	470	0	91	99	Complies with Telecordia Standards (High Temperature/ High Humidity), High Elasticity
AT8224 [Acrylate]	10	5	1.505	145	115	89	>209	Complies with Telecordia Standards (High Temperature/ High Humidity), High Tg

High Refractive Index / Low Refractive Index

Model (Main Ingredient)	Irradition level (UV)*¹	Time (min)
Model (Main Ingredient)	Curing Condition (UV)		Refractive Index (after hardening) @589nm	Viscosity (mPa * s)	Tg (°C)	Hardness (Shore D)	Bond Strength (kgf/cm²)
#18165 [Acrylate]	10	5	1.675	9	113	67	>48
#6205 [Acrylate]	100	5	1.720	20	68	70	35
E3754 [Epoxy]	100	5	1.603	1200	73	76	>280
#7200 [Epoxy]	100	10	1.627	7000	63	8	55
#18204 [Acrylate]	10	1	1.375	7	18	20	27
#18114 [Acrylate]	10	5	1.400	25	94	72	26

Customized Adhesives

Customized range of GA700H / GA700L

Model (Main Ingredient)	Curing Condition (UV)	Refractive Index (after hardening) @589nm	Viscosity (mPa * s)	Tg (°C)	Optical Transmittance (%) @1.3um	Bond Strength (kgf/cm²)	Special Features
Irradition level (UV)*¹	Time (min)
HT**** [Epoxy]	30	10	1.458 ~ 1.567	250 ~ 2000	140 ~ 150	89 ~ 90	>100	High Tg
LT**** [Epoxy]	10	10	1.458 ~ 1.567	200 ~ 560	40 ~ 50	86 ~ 90	>100	Low Tg

Model

(Main Ingredient)

Curing Condition (UV)

Refractive Index
(after hardening)
@589nm

Viscosity
(mPa * s)

Tg (°C)

Optical Transmittance
(%) @1.3um

Bond Strength

(kgf/cm²)

Special Features

Irradition level (UV)*¹

Time (min)

HT**** [Epoxy]

1.458 ~ 1.567

250 ~ 2000

140 ~ 150

89 ~ 90

>100

High Tg

LT**** [Epoxy]

1.458 ~ 1.567

200 ~ 560

40 ~ 50

86 ~ 90

>100

Low Tg

More customization is available other than shown above, so please feel free to ask.

High Precision Adhesives

Precise Fixing

Model (Main Ingredient)	Curing Condition (UV)	Shrinking During curing (%)	Viscosity (mPa * s)	Tg (°C)	Thermal expansion coefficient (ppm/°C)	Bond Strength (kgf/cm²)	Special Features
Irradition level (UV)*¹	Time (min)
AT3862P [Epoxy]	100	2	0.5	500,000	195	20	>210	Low Shrinking Rate
AT3916P [Epoxy]	100	5	0.9	20,000	233	18	>220	Low Viscosity

Model

(Main Ingredient)

Curing Condition (UV)

Shrinking During

curing (%)

Viscosity
(mPa * s)

Tg (°C)

Thermal expansion coefficient (ppm/°C)

Bond Strength

(kgf/cm²)

Special Features

Irradition level (UV)*¹

Time (min)

AT3862P [Epoxy]

100

0.5

500,000

195

>210

Low Shrinking Rate

AT3916P [Epoxy]

100

0.9

20,000

233

>220

Low Viscosity

Adhesive for Fiber Arrays

V-groove Fixings

Model (Main Ingredient)	Irradition level (UV)*¹	Time (min)
Model (Main Ingredient)	Curing Condition (UV)		Refractive Index (after hardening) @589nm	Viscosity (mPa * s)	Tg (°C)	Hardness Shore (D)	Bond Strength (kgf/cm²)	Special Features
AT3925M [Epoxy]	100	10	1.519	200	219	88	>99	Mechanical Polishing is available, Ultra Hard, Heat Resistence Adhesives
AT9390 [Epoxy]	30	10	1.492	600	131	81	>194	Mechanical Polishing is available, Good Transparency
AT9968 [Epoxy]	100	10	1.512	70	181	85	>143	Mechanical Polishing is available, Low Viscosity
AT3727E [Epoxy]	10	10	1.574	400	107	83	>147	Mechanical Polishing is available, Humidity-Resistant, High Tg
AT3728E [Epoxy]	10	10	1.573	400	55	20	>232	Mechanical Polishing is available, Humidity-Resistant, Low Tg

Fiber-end Fixing

Model (Main Ingredient)	Curing Condition (UV)	Viscosity (mPa * s)	Tg (°C)	Hardness Shore (D)	Bond Strength (kgf/cm²)	Special Features
Irradition level (UV)*¹	Time (min)
AT9575M [Epoxy]	100	10	paste	42	35	>221	High Durability, Nonfluxional
AT8105 [Epoxy]	10	5	paste	103	78	>226	High Durability, Nonfluxional

Model

(Main Ingredient)

Curing Condition (UV)

Viscosity
(mPa * s)

Tg (°C)

Hardness

Shore (D)

Bond Strength

(kgf/cm²)

Special Features

Irradition level (UV)*¹

Time (min)

AT9575M
[Epoxy]

100

paste

>221

High Durability, Nonfluxional

AT8105
[Epoxy]

paste

103

>226

High Durability, Nonfluxional

Sealant for Optical Devices

Heat Curable Sealants

Model	Curing Conditions	Pot Life (min)	Water Vapor Transmission Rate*²	Hardness Shore (D)	Bond Strength (kgf/cm²)	Ratio of Mixing (Weight A/B)	Main Component	Conditions before hardening	Special Features
OS5958	RT 24hr or 80°C 1hr	120	1.6x10^-8	47	131	10:3	A: Epoxy Resin B:Amine Hardener	A:White Paste B:Yellow transparent fluid	High Moisture proof Long Pot Life
OS5962	RT 24hr or 80°C 1hr	120	0.7x10^-8	66	146	21:3	A: Epoxy Resin B:Amine Hardener	A:White Paste B:Yellow transparent fluid	High Moisture proof, High Viscosity, Long Pot Life
OS5980	80°C 1hr	120	30x10^-8	20	24	1:2	A:Amine Hardener B:Epoxy Resin	A:Transparent Paste B:Black Paste	Highly Flexiblility
OS-48	RT 24hr or 100°C 1hr	180	1x10^-8 (75°C 90%)	66 (Shore A)	11	1:1	A/ B : Butylene Resin	A:White Paste B:Black Paste	Long Pot Life